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Subproject A2
Microstructuring and Integration Technology for Piezo Fibers in Metallic Carrier Materials (sheet metal)
Project Managers:
Univ-Prof. Dr.-Ing. Andreas SchubertChemnitz University of Technology
Institute for Machine Tools and Manufacturing Processes
Chair of Micromanufacturing Technologies
D-09107 Chemnitz
Telephone: +49-(0)371 / 531-34580
Telefax: +49-(0)371 / 531-34581
E-Mail: andreas.schubert@mb.tu-chemnitz.de
apl. Prof. Dr.-Ing. Dieter Weidlich
Chemnitz University of Technology
Institute for Machine Tools and Manufacturing Processes
Chair of Machine Tools Construction and Forming Technology
D-09107 Chemnitz
Telephone: +49-(0)0371 / 531-38068
Telefax: +49-(0)0371 / 531-23509
E-Mail: wzm@mb.tu-chemnitz.de
Main Focus 1: Process Development for the Microstructuring of Sheet Metal Carriers
(lead-managed by Prof. Schubert)
In this part, the center of interest is the development and testing of new microstructuring technologies for aluminum carriers. The microstructures involved are to guarantee a load-compatible integration of piezo elements. The carriers to structure preferably are 1mm thin aluminum-sheet metals. By means of special forming techniques (stamping, punching) assembly-compatible joining cavities (e.g. U- or V-grooves) with defined substructures (chamfers, installation structure, auxiliary and spring bars) are to be joined to the carrier material. From today’s view, these precise microgeometries will have a size of 20 x 0, 20 x 0, 20 mm³. Accordingly, laws of yielding of the carrier material that significantly determine the forming accuracy need to be explored for the sheet-like stamping or punching of the microstructures. Limiting parameters of the used precision method need to be sounded. The carrier material is to be mechanically loaded as constantly as possible through the microforming process. The produced structure geometries shall enable the following subprocesses of passivation/isolation, integration of the piezo elements and the contacting of the composite. Additional substructures in the cavities are to allow a durable fixation of the piezo elements in the carrier material. Depending on the construction option as presented in SP C1, the microstructures are to be coating-compatible and mechanically resilient. Moreover, they are insisted on causing different friction properties between the piezo element and the construction substance. For the production of such microstructures, a suitable structure geometry, stamping tools and process sequences need to be designed and tested.
In this part, the center of interest is the development and testing of new microstructuring technologies for aluminum carriers. The microstructures involved are to guarantee a load-compatible integration of piezo elements. The carriers to structure preferably are 1mm thin aluminum-sheet metals. By means of special forming techniques (stamping, punching) assembly-compatible joining cavities (e.g. U- or V-grooves) with defined substructures (chamfers, installation structure, auxiliary and spring bars) are to be joined to the carrier material. From today’s view, these precise microgeometries will have a size of 20 x 0, 20 x 0, 20 mm³. Accordingly, laws of yielding of the carrier material that significantly determine the forming accuracy need to be explored for the sheet-like stamping or punching of the microstructures. Limiting parameters of the used precision method need to be sounded. The carrier material is to be mechanically loaded as constantly as possible through the microforming process. The produced structure geometries shall enable the following subprocesses of passivation/isolation, integration of the piezo elements and the contacting of the composite. Additional substructures in the cavities are to allow a durable fixation of the piezo elements in the carrier material. Depending on the construction option as presented in SP C1, the microstructures are to be coating-compatible and mechanically resilient. Moreover, they are insisted on causing different friction properties between the piezo element and the construction substance. For the production of such microstructures, a suitable structure geometry, stamping tools and process sequences need to be designed and tested.
Main Focus 2: Process Development for the Operation and Joining of Piezo Elements
(lead-managed by Prof. Weidlich)
The integration of the piezo fibers requires a highly precise joining to the microcavities of the construction material. The functional material piezoceramics can be provided either by beams sawed out of plates or by extruded fibers. Nowadays the pasting on a backing film seems to be reasonable for the transport and positioning in relation to the microcavities. Thus, the scientific problem comprises on designing and exploring technologies and production systems for the automated separation, transport, positioning and joining of the piezo elements to the cavities. Thereby, miniaturized facilities in compliance with low acceptable tolerances in terms of scale, shape and position will be necessary. In the applied project, procedures suitable for large-scale production are to be investigated and a concept of the therefore required production facilities needs to be developed. This is partly to happen through simulations and partly through experimental investigations. By the end of the first funding term, the concept of the production facilities is expected to be exemplarily available (in CAD, if so, Virtual Reality). Test facilities in which functional piezo semifinished products can prototypically be produced will be supplied for essential subprocesses, such as the joining of the piezo elements.
The integration of the piezo fibers requires a highly precise joining to the microcavities of the construction material. The functional material piezoceramics can be provided either by beams sawed out of plates or by extruded fibers. Nowadays the pasting on a backing film seems to be reasonable for the transport and positioning in relation to the microcavities. Thus, the scientific problem comprises on designing and exploring technologies and production systems for the automated separation, transport, positioning and joining of the piezo elements to the cavities. Thereby, miniaturized facilities in compliance with low acceptable tolerances in terms of scale, shape and position will be necessary. In the applied project, procedures suitable for large-scale production are to be investigated and a concept of the therefore required production facilities needs to be developed. This is partly to happen through simulations and partly through experimental investigations. By the end of the first funding term, the concept of the production facilities is expected to be exemplarily available (in CAD, if so, Virtual Reality). Test facilities in which functional piezo semifinished products can prototypically be produced will be supplied for essential subprocesses, such as the joining of the piezo elements.
Main Focus 3: Process Development for Joining the Piezo Elements to the Carrier Material
(in cooperation)
This field of activity covers the development and exploration of reliable processes and active principles so that the piezo elements located in the cavities can non-destructively be joined. The operable joining composite shall later enable a reliable power transmission from the piezo element to the material. Additionally, it shall also feature a long-term stability and resist thermal and mechanical processing steps (e.g. forming and casting). So, for a permanent fixation of the piezo elements through non-positive and/or positive form locking, such as the joining by means of forming techniques (elastic and plastic forming of the microcavities) as well as by using the properties of the piezo and carrier materials (actuator and mechanic capacities, thermo and ferro elasticity), different initial methods of resolutions need to be researched. The innovative approach is trying to dispense with coupling mechanisms, such as adhesives and potting material between the piezo element and the carrier material.
This field of activity covers the development and exploration of reliable processes and active principles so that the piezo elements located in the cavities can non-destructively be joined. The operable joining composite shall later enable a reliable power transmission from the piezo element to the material. Additionally, it shall also feature a long-term stability and resist thermal and mechanical processing steps (e.g. forming and casting). So, for a permanent fixation of the piezo elements through non-positive and/or positive form locking, such as the joining by means of forming techniques (elastic and plastic forming of the microcavities) as well as by using the properties of the piezo and carrier materials (actuator and mechanic capacities, thermo and ferro elasticity), different initial methods of resolutions need to be researched. The innovative approach is trying to dispense with coupling mechanisms, such as adhesives and potting material between the piezo element and the carrier material.
