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Subproject A3
Production and Optimization of the Insulation Layer
Project Managers:
Prof. Dr. rer. nat. habil. Frank RichterInstitute for Physics at Chemnitz University of Technology
Reichenhainer Str. 70
D-09107 Chemnitz
Telephone: +49-(0)371 / 531-38046
Telefax: +49-(0)371 / 531-33042
E-Mail: f.richter@physik.tu-chemnitz.de
Dr. rer. nat. Siegfried Peter
Institute for Physics at Chemnitz University of Technology
Reichenhainer Str. 70
D-09107 Chemnitz
Telephone: +49-(0)371 / 531-38258
Telefax: +49-(0)371 / 531-33042
E-Mail: s.peter@physik.tu-chemnitz.de
Presenting the Research Program
This project targets on the production and optimization of the insulation layer within the PIESA-process chain “sheet metal”.
The main focus is the deposition of electrical and mechanical highly resilient thin layers on microstructured lightmetal plates (sheet metal). Thus, the plating process has to meet particular requirements to assure the functionality of the layers also on the side walls of the microcavities.
The insulator layers are to be produced by means of plasma-based chemical vapour deposition (PCVD). Besides electrical layer parameters, such as disruptive field strength and Low-K dielectric, it is also necessary to measure mechanical features of the insulator layer and the insulator-piezo material-contact. This includes the elastic module, the critical yield stress, the coefficient of adhesion friction of the conjugations insulator-piezo material and insulator-electrode material as well as the adhesion of the layer on the lightmetal.
On the one hand, these electrical and mechanical parameters are needed for the direct optimization of the layer deposition process, and on the other hand, as important input variables for modeling and dimensioning the microstructure, the integration technology for the piezo bars and the complete sensor-/actuator system.
The main focus is the deposition of electrical and mechanical highly resilient thin layers on microstructured lightmetal plates (sheet metal). Thus, the plating process has to meet particular requirements to assure the functionality of the layers also on the side walls of the microcavities.
The insulator layers are to be produced by means of plasma-based chemical vapour deposition (PCVD). Besides electrical layer parameters, such as disruptive field strength and Low-K dielectric, it is also necessary to measure mechanical features of the insulator layer and the insulator-piezo material-contact. This includes the elastic module, the critical yield stress, the coefficient of adhesion friction of the conjugations insulator-piezo material and insulator-electrode material as well as the adhesion of the layer on the lightmetal.
On the one hand, these electrical and mechanical parameters are needed for the direct optimization of the layer deposition process, and on the other hand, as important input variables for modeling and dimensioning the microstructure, the integration technology for the piezo bars and the complete sensor-/actuator system.
