Subproject A5
Development of thermoplastic-compatible piezoceramic modules (TPM) and corresponding production processes
Project Manager:
Prof. Dr.-Ing. habil. Maik GudeTechnische Universität Dresden
Fakultät Maschinenwesen und
Fakultät Verkehrswissenschaften „Friedrich List“
Institut für Leichtbau und Kunststofftechnik (ILK)
01062 Dresden
Telephon: +49-(0)351 / 463 38153
Telefax: +49-(0)351 / 463 38143
E-Mail: mg@ilk.mw.tu-dresden.de
State of the art in the production of piezoceramic function modules and adaptive lightweight components predominantly is the manual manufacture and application of piezoceramic function modules in extensive bonding processes. Additionally, commercial functional modules are usually based on polyimide (PI) carrier films, which exhibit a limited material compatibility to thermoplastic matrix systems polyamide (PA) and polyetheretherketone (PEEK). Due to the adhesive bonding of the function module components and an additional adhesive film between module and fibre-reinforced thermoplastic structure, a loss of deformation transfer and an inefficient use of sensor and actuator potentials are obvious. For a high volume production of intelligent lightweight structures a transition from the assembly oriented to a technology-oriented actuator integration is necessary.
In the first phase the systematic development of novel thermoplastic-compatible piezoceramic modules (TPM), whose thermoplastic carrier film is adapted to the thermoplastic matrix of the composite structure, as well as associated high volume manufacture technologies were aimed at. By defined melting of the thermoplastic components of TPM and composite structure, a material homogeneous embedding of TPM in composite structures can be realised during the subsequent processing of the TPM with a direct technique. Thus conventional additional adhesive bonding steps and corresponding inhomogeneities and compatibility problems can be avoided.
Figure 1: Thermoplastic-compatible piezoceramic module (TPM) on PA6 carrier film
Special attention in the TPM development is put on the manufacture process and the material compatible design of the novel functional modules by means of numerical simulations, manufacture studies as well as destructive and non-destructive testing. Further focus is the conception and design as well as the installation of corresponding manufacture facilities for the assembly and manufacture of TPM by use of an adapted hot-pressing technology.
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In the second project phase the first basic piezoceramic modules with PA and PEEK carrier films are developed further and manufactured by means of a novel quasi-continuous production process. Besides the technology and material adapted structural concept, the focus is turned on the functional enhancement of the module design with regard to different functional principles (d33 and d31 principle) and the utilization of anisotropic carrier films. Furthermore the specifically designed and installed unique module manufacture unit – consisting of making-up and consolidation by hot-pressing technology – will be completed by the process steps electrode application and piezo-placement to achieve a continuous manufacture process chain. By accompanying process simulations and process chain analysis the technical-technological interactions have to be coordinated. Therefore the technological influences on the technical properties of the TPM need to be analyzed and concluding the technological parameters have to be adapted for the systematic adjustment of defined technical properties.
